MHI offering room-temperature semiconductor wafer bonding services

Mitsubishi Heavy Industries, Ltd. (MHI) launched semiconductor wafer bonding services by using in house developed wafer bonding machines capable of bonding different kind of materials at room temperature.

Room-temperature bonds semiconductor wafer through irradiating ion beams and atom beams in a vacuum without heating the wafer.

Room-temperature bonding is suggested as perfect solution for the production of MEMS devices. Bondable materials include silicons, oxide dielectrics, glass, compound semiconductors, metals, ceramics, etc.

For further information about room-temperature wafer bonding visit:
http://www.mhi-global.com/products/detail/wafer_bonding_machine.html