Mitsubishi Heavy Industries, Ltd. (MHI) launched semiconductor wafer bonding services by using in house developed wafer bonding machines capable of bonding different kind of materials at room temperature.
Room-temperature bonds semiconductor wafer through irradiating ion beams and atom beams in a vacuum without heating the wafer.
Room-temperature bonding is suggested as perfect solution for the production of MEMS devices. Bondable materials include silicons, oxide dielectrics, glass, compound semiconductors, metals, ceramics, etc.
For further information about room-temperature wafer bonding visit:
http://www.mhi-global.com/products/detail/wafer_bonding_machine.html
