Electronics Engineering Herald                 
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

New Products

  Date: 24/08/2014

MHI offering room-temperature semiconductor wafer bonding services

Mitsubishi Heavy Industries, Ltd. (MHI) launched semiconductor wafer bonding services by using in house developed wafer bonding machines capable of bonding different kind of materials at room temperature.

Room-temperature bonds semiconductor wafer through irradiating ion beams and atom beams in a vacuum without heating the wafer.

Room-temperature bonding is suggested as perfect solution for the production of MEMS devices. Bondable materials include silicons, oxide dielectrics, glass, compound semiconductors, metals, ceramics, etc.

For further information about room-temperature wafer bonding visit:
http://www.mhi-global.com/products/detail/wafer_bonding_machine.html



 
ADVT
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2010 Electronics Engineering Herald