To increase the speed of manufacturing of flexible electronic PCBs and substrates, Nordson MARCH introduced a new manufacturing equipment called FlexVIA-Plus Plasma Treatment System handling single-stage plasma processing including etchback and desmear of up to 30 panels (panel size 500x813mm / 20x32 inch) per cycle, enabling a rate of as much as 200 units per hour (UPH).
The FlexVIA-Plus System is integrated with versatile horizontal racks supporting optimum material alignment and supporting different flexible PCB sizes so that loading of i/p materials is made easy. The system is also designed to consume less gas.
Nordson claims FlexVIA-Plus Plasma System features esmear and etchback technologies to remove epoxies, polyimides, high Tg blends, mixed materials and other resins more effectively than traditional methods of etching and desmearing. The descum capabilities effectively remove resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability and temperature-controlled electrodes ensure consistent process repeatability, as per Nordson.
“The new FlexVIA-Plus Plasma System performs similarly to our ProVIA system, but in a horizontal form-factor, which is ideal for processing flexible PCBs,” said Jonathan Doan, director of marketing, Nordson MARCH. “This system meets the demands of today’s high-throughput flexible circuit board manufacturing operations.”