Electronics Engineering Herald                 
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

New Products

  Date: 29/05/2014

Improved flexible electronic PCB manufacturing system from Nordson

To increase the speed of manufacturing of flexible electronic PCBs and substrates, Nordson MARCH introduced a new manufacturing equipment called FlexVIA-Plus Plasma Treatment System handling single-stage plasma processing including etchback and desmear of up to 30 panels (panel size 500x813mm / 20x32 inch) per cycle, enabling a rate of as much as 200 units per hour (UPH).

The FlexVIA-Plus System is integrated with versatile horizontal racks supporting optimum material alignment and supporting different flexible PCB sizes so that loading of i/p materials is made easy. The system is also designed to consume less gas.

Nordson claims FlexVIA-Plus Plasma System features esmear and etchback technologies to remove epoxies, polyimides, high Tg blends, mixed materials and other resins more effectively than traditional methods of etching and desmearing. The descum capabilities effectively remove resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability and temperature-controlled electrodes ensure consistent process repeatability, as per Nordson.

“The new FlexVIA-Plus Plasma System performs similarly to our ProVIA system, but in a horizontal form-factor, which is ideal for processing flexible PCBs,” said Jonathan Doan, director of marketing, Nordson MARCH. “This system meets the demands of today’s high-throughput flexible circuit board manufacturing operations.”



 
ADVT
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2010 Electronics Engineering Herald