Electronics Engineering Herald                 
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

New Products

  Date: 17/03/2014

Tiny multilayer diplexer for implementation of 2.4 GHz/5 GHz band WLAN

TDK Corporation has developed a new multilayer diplexer in case size IEC 1005 (dimensions of only 1.0 mm x 0.5 mm x 0.4 mm) for the implementation of 2.4 GHz/5 GHz band WLAN in smartphones and other mobile devices.
DPX105950DT-6010B1 diplexer though small provides equal or even better insertion loss and attenuation performance. For example, the maximum low band insertion loss at 2.4 to 2.5 GHz is just 0.5 dB, while the high band attenuation in the same frequency range is at least 25 dB. Mass production of the new diplexer has started in February 2014.

The new product features a combination of layers with different dielectric constants, which are produced using TDK’s co-firing technology. TDK was able to further miniaturize its diplexer by using even thinner ceramic layers and finer conductor lines. The product is rated for an operating temperature of -40°C to +85°C and is suitable for use in the Bluetooth and WLAN circuitry in mobile devices.



 
ADVT
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2010 Electronics Engineering Herald