TDK Corporation has developed a new multilayer diplexer in case size IEC 1005 (dimensions of only 1.0 mm x 0.5 mm x 0.4 mm) for the implementation of 2.4 GHz/5 GHz band WLAN in smartphones and other mobile devices.
DPX105950DT-6010B1 diplexer though small provides equal or even better insertion loss and attenuation performance. For example, the maximum low band insertion loss at 2.4 to 2.5 GHz is just 0.5 dB, while the high band attenuation in the same frequency range is at least 25 dB. Mass production of the new diplexer has started in February 2014.
The new product features a combination of layers with different dielectric constants, which are produced using TDK’s co-firing technology. TDK was able to further miniaturize its diplexer by using even thinner ceramic layers and finer conductor lines. The product is rated for an operating temperature of -40°C to +85°C and is suitable for use in the Bluetooth and WLAN circuitry in mobile devices.