Fast emerged China based fabless mobile phone SOC chip vendor Spreadtrum Communications has licensed the CEVA-TeakLite-4 DSP using its next gen smartphone SoC chips.
"Battery life and advanced voice processing capabilities were two of the primary DSP selection criteria for our next-generation smartphone platforms, and the CEVA-TeakLite-4 DSP delivers outstandingly in both respects," said Dr. Leo Li, chairman and CEO of Spreadtrum. "We are pleased to extend our close collaboration with CEVA, reflecting the high level of innovation, quality and support they consistently deliver us."
"Spreadtrum continues to lead the industry in cost-efficient, highly-integrated smartphone platforms, enabling many millions of people in developing nations access to the benefits of smartphone technology annually," said Issachar Ohana, executive vice president of worldwide sales at CEVA. "We have enjoyed a long and successful partnership with Spreadtrum for many years and are pleased to enhance our cooperation to include our latest generation DSP technology."
The CEVA-TeakLite-4 is the fourth generation DSP based on the CEVA-TeakLite architecture, the most successful licensable DSP family in the history of the semiconductor industry, with more than 2.5 billion audio/voice chips shipped, over 100 licensees, 30 active ecosystem partners and more than 100 audio and voice software packages available, according to CEVA.