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Date: 18-09-13

Board Level shields to minimize RFI and EMI

TE Connectivity has introduced board level shielding (BLS) products for mobile RF devices such as cell phones. TE board level shields are stamped or drawn one- and two-piece metal cages that help provide isolation of board level components, minimize crosstalk and reduce electromagnetic interference (EMI) susceptibility without impacting system speed.

“Stamping, forming and automation have been TE core competencies for decades,” said Frank Basile, product manager, TE Consumer Devices. “With the introduction of BLS, we are able to leverage these competencies into customer benefits that allow faster time-to-market and volume, at competitive prices.”

The latest BLS product will use standardized features, such as contact and locking dimples, corner shape and bending radii. Sample turnaround time for customized BLS parts is about 72 hours, depending on complexity.

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