AMD has announced new CPU offerings for the AMD Embedded R-Series with options that include quad-core and dual-core CPUs scaling from 2.2 GHz to 3.2 GHz with Thermal Design Power (TDP) ranging from 17 to 35 watts for applications that require high performance x86 compute such as network attached storage (NAS.).
AMD claims the new AMD R-Series CPUs offer up to 2.5X greater performance-per-dollar compared to Intel i3 processors. The combination of new AMD R-Series CPUs with separate AMD Radeon E6460 or E6760 graphics can be used to connect six independent displays.
“There is a need for a greater variety of processor and graphics options in several market segments ranging from storage to digital signage and gaming to meet ever growing performance requirements,” said Kamal Khouri, director of Embedded Products, AMD. “The AMD Embedded R-Series CPU platform targets performance-intensive embedded applications with a new discrete graphics program to meet the diverse, high-performance requirements of the embedded engineering community. These new choices offer higher compute and graphics throughput plus compelling TCO for the embedded market.”
The new AMD Embedded R-Series CPU options are currently available, with products from Advantech, Advantech-Innocore, Aewin, DFI, MSC Embedded, Quixant and other leading original design manufacturers (ODMs). The new orderable part numbers (OPNs) are:
AMD Embedded R-Series RE464X CPU
Quad-core, 35W TDP, CPU freq. 2.3GHz, Max boost freq. 3.2GHz
AMD Embedded R-Series RE272X CPU
Dual-core, 35W TDP, CPU freq. 2.70GHz, Max boost freq. 3.2GHz
AMD Embedded R-Series RE264X CPU
Dual-core, 17W TDP, CPU freq. 2.2GHz, Max boost freq. 2.8GHz