Toshiba Corporation has expanded its package line-up of interface-converter bridge ICs for high resolution LCD display that are used in tablet PC, Ultrabooks and other applications. Mass production of "TC358778XBG" is scheduled to start in June, followed by "TC358777XBG" in July.
The ball pitch of the original product is 0.4mm, and fine pitch assembly equipment is required for production. Expanding the ball pitch from 0.4mm to 0.65mm achieves assembly with no need for such equipment. Toshiba has also optimized the pin assignment for layout without high cost PCB with more than 4 layers.
Those new package products reduce the set makers' cost of assembly and materials.
Ball pitch expanded from 0.4mm to 0.65mm
Optimized pin assignment allows layout with no need for high cost PCB with more than 4 layers
Main specificationsPart Number TC358777XBG TC358778XBG
Resolution 2580 × 2048
(24bit, 60fps) 1900 × 1200
Input Interface MIPI 4 lanes × 2ch
(MIPI 1 lane = 1Gbps) MIPI DPI 24 bit
Output Interface Display Port × 4ch
(Display Port 1 lane = 2.7Gbps) MIPI 4 lanes
(MIPI 1 lane = 1Gbps)
7mm × 7mm
0.65mm pitch VFBGA80
7mm × 7mm
Mass production status July, 2013 June, 2013