Rogers Corporation has launched next generation RO4360G2 laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOT’s).
In 2010, Rogers Corporation launched its groundbreaking product, RO4360 laminate, the first high Dk RF thermoset laminate. Rogers has now launched the next generation, RO4360G2 laminate, with improved thermal reliability that will help fabricators achieve higher UL MOT’s. With a tailored high Dk of 6.15 @ 10 GHz, this recently launched material allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminate’s higher Dk allows for a significant reduction in finished circuit board size (20-30%). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B material.
UL 94V-0 flame rating (pending) and fully lead-free process capable, RO4360G2 laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.
Typical applications for RO4360G2 laminates are power amplifiers, LNAs, RF components (combiners/splitters), patch antennas, and as a replacement material for designs previously employing LTCC (low temperature, co-fired ceramic). RO4360G2 laminates are the material solution designers working on 4G and next generation defense/aerospace platforms have been looking for.
Source: Rogers Corp