Passive component expert TDK Corporation has developed a miniaturized multilayer chip bead series in case size 0603 (EIA 0201) that is nearly 80 percent smaller in volume and 65 percent in area than existing MMZ1005-E types with comparable performance. Available in dimensions of just 0.6 x 0.3 x 0.3 mm³ MMZ0603-E series is currently available in two high-impedance versions, one rated for 600 ohms and the other for 1000 ohms at 100 MHz. Both types offer impedance values at 1 GHz of 1000 ohms and 1800 ohms, respectively.
MMZ0603-E multilayer chip bead is suggested for eliminating noise in compact mobile devices such as smartphones that must operate with multiple communication frequency bands.
TDK has employed its Gigaspira production technology, which creates a micro-coil winding that is perpendicular to the terminal electrodes, effectively suppressing stray capacitance from the terminals.
Availability: Mass production started in February 2013.
Main applications: Mobile devices such as smartphones, tablet PCs, audio players, and digital cameras, Compact devices with wireless connectivity such as Bluetooth, WLAN, GPS, etc., Data storage devices such as HDDs