Electronics Engineering Herald                  ADVT
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Logic and Interface
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement

New Products

  Date: 06/03/2013

Thermally and mechanically robust 30-100V range MOSFETs for Automotive apps

NXP Semiconductors N.V. has introduced 54 new automotive-qualified MOSFETs in an LFPAK56 package. NXPs LFPAK56 MOSFETs are designed to save more than 55 percent of the footprint area compared to DPAK. The LFPAK56 MOSFETs are suitable for a wide range of automotive applications, particularly in the areas of powertrain; body and security; and chassis and safety.

The mechanical robustness and excellent thermal performance of LFPAK56, combined with its small footprint, make it ideal for high-reliability automotive applications. The proven quality of NXPs integrated copper clip technology along with the breadth of our MOSFET portfolio have made it a popular choice for designers who want to select the power MOSFET with the right parameters for their application, said Jamie Dyer, international product marketing manager, NXP Semiconductors.

NXP LFPAK56 power MOSFETs are available at voltage grades of 30V, 40V, 60V, 80V and 100V, with low RDS(on) performance and current handling capability. Examples highlighting the range of the portfolio include:
BUK9Y3R0-40E. With a low RDS(on) of only 3.0 miili ohms at 40V, and the ability to handle currents as high as 100A, this part is ideal for motor drive applications such as those found in seat control, window lifters, windscreen wipers and other body control applications as well as pumps and fans.
BUK9Y59-60E. With an RDS(on) of 59 milli ohms at 60V, this part is ideal for engine management systems such as gasoline direct injection and diesel direct injection, which typically require multiple parts per system, due to its small size as well as its excellent ruggedness capability.
BUK9Y38-100E. With an RDS(on) of 38 milli ohms at 100V, this part is ideal for automotive LED applications, due to its ultra-low package inductance and small footprint.

Package innovation: NXP says LFPAK gull-wing leads allow for thermal expansion and mechanical strain due to PCB bending and flexing. The integrated copper clip also provides low electrical resistance, low thermal resistance, low inductance, and high reliability. The new LFPAK56 MOSFETs are fully AEC-Q101 qualified and said to have successfully completed extended lifetime testing at 175C for more than 1,600 hours.

Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2010 Electronics Engineering Herald