TDK Corporation has unveiled a new multi-channel power management module featuring a power supply management IC chip that is embedded directly into the substrate. Packed with surface-mounted capacitors and power inductors, the module measures 11.0mm x 11.0 mm x 1.6 mm so that it is preferred by mobile device developers for use in smart phone and tablets.
The new power management module offers efficient step-down converter power supply in a 5-channel configuration with a maximum output of 2.6 A, and its low-noise, low-loss voltage regulator power supply for up to 23 channels. Efficient lithium-ion secondary battery charging circuit is also included. IC completely embedded in the miniature three-dimensional SESUB structure which said to offer better thermal attributes compared with solutions with discrete packaged ICs. The module also designed to provide improved EMC performance due to the self-shielding effect of its design.
Main features and benefits in short:
High-efficiency, 5-channel step-down converter power supply with an output of up to 2.6 A
Low-noise, low-loss voltage regulator type power supply (max. 23 channels)
High-efficiency lithium-ion secondary battery charging circuit for up to 4 A
LCD backlight power supply
Step-up converter power supply for camera flash
Flash memory for 256 kB of program data and 8 kB of data memory
Reference quartz oscillator for real-time clock
Miniature dimensions of only 11.0 mm x 11.0 mm x 1.6 mm
Terminals: 0.5-mm pad pitch, 20 x 21 array, 380 pads