electronics engineering Herald                                          
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

Date: 27th May 2011

High-speed in-vehicle data bus assemblies from Molex

Molex Incorporated has announced the expansion of its HSAutoLink Interconnect System. Molex says its HSAutoLink high-speed in-vehicle data bus assemblies deliver robust connectivity to commercial automotive and other transportation sectors.

HSAutolink system meets automotives EMI and EMC requrements. These bus assemblies take less space and designed to meet high speed performance in vehicle-to-vehicle communications, infotainment, telematic devices, safety cameras, and other in-vehicle applications.

"The average new vehicle contains more than twice as many electrical circuits as models produced a decade ago. As demand for advanced navigation, safety, comfort, and infotainment content increases, Molex is innovating solutions to simplify electrical distribution systems and enable the feature-rich environment consumers have come to expect," states Mike Gardner, global marketing manager, infotainment and in-vehicle networks, Molex.

The HSAutoLink connectors and cables are configured to deliver Universal Serial Bus (USB 2.0), Low Voltage Differential Signaling (LVDS), Ethernet, and other emerging In-Vehicle network technologies. The HSAutoLink packaged assembly deploys an economical five-pin shielded connector system from the consumer market that has been ruggedized to meet automakers' mechanical requirements.

The angled exits or short profile, right angle exit (RAE) allow the assembled cable to exit the device at various angles, providing alternative routing options in confined areas. The RAE version features a compact connector footprint, allowing cable connections in areas with obstructions directly behind the interface.

The HSAutoLink line complies with the automotive industry-standard USCAR-30 compliant interface supporting USB 2.0 requirements for OEM system certification. Full-length cable shielding provides increased performance and reduced EMI. The USB Standard A receptacles feature shrouded and positive bezel-latching capabilities to provide in-vehicle mounting for passengers' easy access to connect to media devices such as MP3 players, flash drives and portable navigation systems.

Gardner adds, "We are seeing striking shifts in the way consumers evaluate automobile purchases. Next-generation car buyers know the conveniences they want. Many place as much emphasis on the technology and connectivity of a vehicle as on the brand and model. The HSAutoLink family offers the total in-vehicle network package to manufacturers seeking to economically reduce weight and space, while delivering a high bandwidth 'cool' factor."

For more information, visit: www.molex.com


 
Xilinx 7 series FPGA
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2010 Electronics Engineering Herald