electronics engineering Herald                                          
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

Date: 31st Aug 2010

Trident's 3D TV chip to use Sensio's 3D technology

Trident said it will use Sensio's 3D technology to power its 3D TV chip; TV550 SoC. Sensio Technologies' 3D technology is gaining popularity due to increased interest in 3D both by the industry as well as end user. Sensio offers technology to convert the 3D image into Sensio's 3D format which then can be transmitted over any 2D channel, at the receiving end 3D-content in Sensio format is decoded into original 3D content.

Trident says Sensio 3D is frame-compatible format for high-quality stereoscopic signal processing and is easily integrated into TV products. This technology is developed by Sensio over ten years ago.

 
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2006 Electronics Engineering Herald