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Date: 14th Apr 09

 Tarari processor based boards for deep packet security inspection in networks

In-depth checking of data packets in networks is the sophisticated method to safeguard the network from unwanted intrusions. LSI, which is already offering semiconductor devices to process the network content at packet level, is now also offering boards for deep packet inspection with form factors supporting PCIe, mini-PCIe, mini-PCI and Advanced Mezzanine Card (AdvancedMC) standards.

The four new boards based on LSI's Tarari content processor are,

7900 series: Supports the mini-PCI form factor and offers from 250 Mb/s to 1 Gb/s performance. All 7900 series boards use the same form factor, which facilitates base design reuse.

8600 series: Supports PCIe 8 lane Gen 1/Gen 2 and offers performance at 6, 12 or 20 Gb/s, while managing up to 8 million simultaneous network connections and processing up to one million regular expressions per second.

8800 series: Supports the AMC form factor for Advanced TCA (ATCA) and Micro TCA (µTCA) chassis. Offering performance at 3, 6 or 12 Gb/s, these boards can offload deep packet inspection on a wide range of multi-core processors including Intel® Xeon, AMD Opteron, Cavium Octeon and RMI XLS based blades.

8900 series: Supports mini-PCIe and is intended for applications from 250 Mb/s to 3 Gb/s where small size and low power are crucial. All 8900 series boards use the same form factor, which facilitates base design reuse.

The 7900, 8800 and 8900 series will sample in June. The 8600 will sample in July.

Implementing powerful firewall features is now made easier with this availability of both boards and silicon options. OEMs can choose either chip or board based on their availability of internal resources and time.

"LSI Tarari Content and Security Processor solutions are targeted at OEM equipment lines that require a very broad range of performance - from hundreds of megabits to tens of gigabits per second," said Randy Smerik, senior vice president, Network Components Division, LSI.

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