ST Micro announced quarter-inch 5MP CMOS image-sensor roadmap for mobile phones

STMicroelectronics has announced roadmap for new 5M-pixel CMOS image sensors in a quarter-inch optical format used in camera-phone handsets, with options including raw Bayer or System-on-Chip (SoC) sensors, support for Extended Depth of Field (EDoF) or cameras with an on-chip autofocus driver, high-speed data interfaces, and package technologies supporting camera assemblies, and the latest ultra-small wafer-level cameras.

The announcement follows the launch of 3-megapixel EDoF sensors announced by ST in February 2009. "Our new 5-megapixel quarter-inch sensors are part of our strategy to build a complete and competitive EDoF sensor roadmap," said Arnaud Laflaquiere, ST's Sensor Business Unit Director. "Utilizing our most advanced 65/45nm pixel technology with unique techniques to maximize image quality, as well as packaging compatible with wafer-level camera assembly, enables us to deliver a wide range of innovative and attractive solutions at competitive system costs."

ST employs unique pixel-isolation techniques to reduce the noise in the image.

Other sensors in the roadmap will serve applications where auto-focus is preferred by integrating a Voice Coil Motor (VCM) driver for the focusing mechanism.

The sensors will feature high-speed parallel interfaces enabling direct connection to the processors for cellphone applications.

STMicro will offer standard-die and Through-Silicon Via (TSV) packaging in the 5M-pixel roadmap, enables emerging technologies such as Wafer-Level Camera (WLC), which offers automated camera assembly at the wafer level with quality improvements in camera phones and other digital imaging products.

For more details visit www.st.com

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