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Date: 7th Oct 09
MagnaChip Semiconductor unveiled 7 types of MOSFETs for notebooks
MagnaChip Semiconductor unveiled 7 types of MOSFET packages
for notebooks (part numbers: MDV 2655 to 2660, MDV 1660).
The part numbers utilize PowerDFN33 MOSFET package that
provides package with size and height shrunk 63% and 33%,
respectively but with electrical and heat performance the
same as the SOIC-8 package which has been adopted for notebooks.
The PowerDFN33 MOSFET release has added package lineup
for computers, making four package types available, including
DPAK, SOIC-8, and upgraded PowerDFN56 and PowerDFN33.
MagnaChip also plans to offer dual channels, which have
two chips embedded in one package, easy to design PCBs and
feature better heat protection through even heat distribution.
"These new PowerDFN3x3 solutions allow MagnaChip to
provide a total solution for mobile applications including
notebook and netbook computers. These latest offerings allow
us to better serve customer needs." and "We intend
to increase our share in the MOSFET market by continuing
to release industry leading products and packages in the
future," said Sang Park, CEO of MagnaChip.
For more details visit www.magnachip.com
Editorial rating of this new product: Average
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