AMD targets embedded market by launching new platforms

AMD has announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform.

"The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon," said Buddy Broeker, director, Embedded Solutions Division, AMD. "AMD's embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion™ technology products into the embedded space."

New Platform Features:

Faster memory with support for 2 channels DDR3
Improved I/O for high-throughput and real-time applications with available HyperTransport 3.0 technology
ECC for high-reliability applications like SMB/SOHO storage systems
Multiple CPU options that offer wide choice of performance and power
Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP
Single-, dual- and quad-core
Up to 2.8 GHz
AMD 785E chipset with support for PCI Express 2.0
New ATI Radeon HD 4200 graphics with DirectX 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs