Graphics SoC from Fujitsu for modular automotive display designs

Fujitsu has introduced the MB86R02, a new "Jade D" SoC that incorporates the Fujitsu MB86296 "Coral" graphics processor unit (GPU) with a 32-bit ARM926EJ-S CPU core. The MB86R02 SoC based on the Fujitsu 90nm CMOS process technology, optimized for modular automotive display applications requiring high CPU performance and 2D/3D graphics. The MB86R02 SoC is suitable for graphical dashboard systems, head-up display units, on-board navigation systems, rear-seat entertainment, point-of-sale terminals and industrial control panels applications.

Fujitsu says that it was the first silicon vendor to integrate the APIX interface into microcontrollers and graphics controllers. The combination of the GPU with Fujitsu's multi-display controller technology offers an array of special features not found in graphics systems, gives more options for managing graphics and processing images. The floating point GPU produces full 3D effects including transformations, rotations, volume clipping and culling.

The built-in links in the MB86R02 can be used for various link speeds up to 1Gbit/s. Both links are configurable as transmitter or receiver, and support the sideband channel for peripheral data. A built-in TCON unit enables the MB86R02 "Jade-D" device to directly drive the panels without the need for further controller logic. The device offers multiple methods for connecting to the display panels including APIX, RGB digital or RSDS.

"The MB86R02 'Jade-D' graphics SoC is a highly integrated and efficient graphics display controller, offering the best price/performance ratio for today's instrument controller applications," said Dan Landeck, senior strategic marketing manager, Fujitsu Microelectronics America. "The device features Fujitsu's proven MB86296 'Coral' GPU, which has become the mainstay in many of today's TFT-based automotive instrument clusters. The SoC also reflects Fujitsu's strong commitment to technology leadership in bringing optimal video and graphics to in-vehicle applications, as well as our commitment to collaborating closely with automakers, their tier-one suppliers and other semiconductor suppliers such as Inova."

Package: 484-pin TEBGA (Thermal Enhanced BGA) package
Price: Each $38.00
Availability: Now

For more details visit www.fujitsu.com