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9th Nov 06
Cypress
and Winbond jointly built a demo kit for VOIP headset.
Cypress with it's flash microcontroller and Winbond's codec
has launched development kit for Wireless VOIP headset.
The test board is made of Cypress's low-power WirelessUSB™
LP (CYRF6936) 2.4-GHz radio system-on-chip, Wireless enCoRe
II flash microcontroller and Winbond's W681360 CODEC.
The issue of packet-dropping is addressed in this kit which
provides uninterrupted flow of data. The wirelessUSB protocol
of Cypress is robust in terms of interference immunity and
suppose to perform better than Bluetooth and DECT based
solutions.
Winbond's W68130 is selected for it's signal quality and
low power consumption..
The key advantages of this kit are, low power consumption,
range, robustness, and also low cost.
The kit is bundled with following items:
WirelessUSB LP Headset Board; made of Cypress WirelessUSB
LP (CYRF6936), Wireless enCoRe II (CY7C60323) flash MCU
and Winbond (W681360) 3V Single-Channel CODEC
WirelessUSB LP Bridge; made of WirelessUSB LP (CYRF6936)
and enCoRe III (CY7C64215) USB flash MCU
WirelessUSB LP Demo Kit CD-ROM with schematics, BOM, and
firmware
Available: Now
Price: $249
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